全文获取类型
收费全文 | 11858篇 |
免费 | 1823篇 |
国内免费 | 784篇 |
专业分类
电工技术 | 1375篇 |
综合类 | 955篇 |
化学工业 | 1828篇 |
金属工艺 | 1677篇 |
机械仪表 | 508篇 |
建筑科学 | 560篇 |
矿业工程 | 176篇 |
能源动力 | 349篇 |
轻工业 | 849篇 |
水利工程 | 128篇 |
石油天然气 | 515篇 |
武器工业 | 157篇 |
无线电 | 1343篇 |
一般工业技术 | 1297篇 |
冶金工业 | 1362篇 |
原子能技术 | 107篇 |
自动化技术 | 1279篇 |
出版年
2024年 | 48篇 |
2023年 | 273篇 |
2022年 | 430篇 |
2021年 | 609篇 |
2020年 | 615篇 |
2019年 | 519篇 |
2018年 | 405篇 |
2017年 | 481篇 |
2016年 | 537篇 |
2015年 | 560篇 |
2014年 | 771篇 |
2013年 | 817篇 |
2012年 | 889篇 |
2011年 | 905篇 |
2010年 | 746篇 |
2009年 | 729篇 |
2008年 | 644篇 |
2007年 | 732篇 |
2006年 | 675篇 |
2005年 | 532篇 |
2004年 | 438篇 |
2003年 | 402篇 |
2002年 | 308篇 |
2001年 | 301篇 |
2000年 | 205篇 |
1999年 | 183篇 |
1998年 | 118篇 |
1997年 | 81篇 |
1996年 | 70篇 |
1995年 | 91篇 |
1994年 | 87篇 |
1993年 | 64篇 |
1992年 | 44篇 |
1991年 | 29篇 |
1990年 | 30篇 |
1989年 | 36篇 |
1988年 | 12篇 |
1987年 | 8篇 |
1986年 | 2篇 |
1985年 | 4篇 |
1984年 | 6篇 |
1983年 | 5篇 |
1982年 | 3篇 |
1980年 | 5篇 |
1979年 | 4篇 |
1978年 | 2篇 |
1964年 | 1篇 |
1958年 | 1篇 |
1956年 | 1篇 |
1951年 | 2篇 |
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
61.
《中国有色金属学会会刊》2022,32(10):3312-3320
The effects of trace addition of Al2O3 nanoparticles (NPs) on thermal reliabilities of Sn-0.5Ag-0.7Cu/Cu solder joints were investigated. Experimental results showed that trace addition of Al2O3 NPs could increase the isotheraml aging (IA) and thermal cyclic (TC) lifetimes of Sn-0.5Ag-0.7Cu/Cu joint from 662 to 787 h, and from 1597 to 1824 cycles, respectively. Also, trace addition of Al2O3 NPs could slow down the shear force reduction of solder joint during thermal services, which was attributed to the pinning effect of Al2O3 NPs on hindering the growth of grains and interfacial intermetallic compounds (IMCs). Theoretically, the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10-10 to 0.79×10-10 cm2/h in IA process, and from 0.92×10-10 to 0.53×10-10 cm2/h in TC process. This indicated that trace addition of Al2O3 NPs can improve both IA and TC reliabilities of Sn-0.5Ag- 0.7Cu/Cu joint, and a little more obvious in IA reliability. 相似文献
62.
63.
64.
A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n ≈ 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress. 相似文献
65.
分别研究了预分散酚醛树脂HY-2045(预)、HY-2055(预)和SP-1055(预)对CIIR胶料硫化特性、力学性能及100℃×72h热空气老化性能的影响,并与原树脂HY-2045(原)、HY-2055(原)和SP-1055(原)的影响效果进行了对比。结果表明,与原酚醛树脂相比,预分散酚醛树脂在CIIR橡胶中的分散性、硫化胶拉伸强度和拉断伸长率均获得提高。加入SP-1055(预)可明显缩短CIIR胶料的t90;加入HY-2045(预)可使胶料的t10和t90延长,交联密度、硬度、100%定伸应力和拉伸强度均最小,拉断伸长率最大;加入HY-2055(预)可使胶料的t90延长,其他性能与加入SP-1055(预)的胶料相差不大。加入HY-2055(预)的硫化胶100℃×72h热空气老化后性能变化最小。 相似文献
66.
采用光学显微镜、扫描电镜和显微硬度仪等研究了T4和T6热处理对Mg-2.5Zn-1.5Ca-0.22Zr镁合金显微组织及硬度的影响。结果表明:Mg-2.5Zn-1.5Ca-0.22Zr镁合金经T4热处理之后,网状结构的β-Ca2Mg6Zn3相逐渐分解并转变为不规则的团聚的块状结构,MgZn2相逐渐溶解于α-Mg基体中,硬度比铸态时显著提高,达到63.87 HV;经过不同时间的T6热处理之后,MgZn2相从α-Mg基体中重新析出,球状的Mg2Ca中间化合物均匀的分布于晶粒内且发生明显长大。随着时效时间的延长,MgZn2相增多,对位错的钉扎增强,合金的硬度提高,在"峰时效"时的硬度达到64.97 HV。410℃×24 h固溶处理后150℃×8 h时效处理为Mg-2.5Zn-1.5Ca-0.22Zr镁合金的最佳热处理工艺。 相似文献
67.
Degradation is an unavoidable part of a material's life making it important to both monitor and control the aging behavior of plastics. This study compares thermooxidative degraded composites of a novel bio-based and sustainable filler, Biocarbon (MBc), against that of traditional and commercially available fillers (glass fiber and talc) used in the automotive industry. The influence of thermooxidative degradation on the composites was studied under accelerated heat aging for 1000 h at 140°C. The mechanical properties of the composites were evaluated using notched Izod impact as well as both tensile and flexural tests. Morphological structure of the composites was investigated using a scanning electron microscopy. Dynamic mechanical analysis and differential scanning calorimetry were used to evaluate the physical transitions both before and after aging. The glass-filled composites displayed the best performance; while, both the talc and biocarbon composites possessed similar strength and ductility performances. Advantageously, the biocarbon composites experienced an 11% reduction in density as compared to talc-filled composites with similar weight content. After aging, all composites exhibited reduced tensile and flexural strengths ranging from 5 to 67% partly due to chain scission. Whereas, the modulus of all composites increased with a range of 1–24% due to an annealing effect. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48618. 相似文献
68.
Evgenia Kollia Xrisoula Saridaki Dimitrios Karagiannis Vassilis Kostopoulos 《应用聚合物科学杂志》2020,137(13):48787
Present work investigates the effect of hydrothermal aging of flax fiber-reinforced bio-based epoxy resin laminates on the mechanical and thermomechanical properties of the composites. Three different types of bio-based resins were used. Plates reinforced with eight layers plain weave flax fibers of 150 g/m2, manufactured using Resin Transfer Molding (RTM), compression molding or autoclave technique depends on type of the resin. One dimensional Fickian behavior shows a good fitting to the experimental data derived from weight measurements. The water uptake at the equilibrium state in the case of 60 °C temperature was slightly greater than that at 40 °C. The mechanical properties after hydrothermal aging show a significant reduction and do not return to their initial values even after the drying process. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48787. 相似文献
69.
ABSTRACTA series of experiments are performed to investigate the effects of physical aging on thermomechanical properties of poly(ethylene terephthalate)-glycol (PETG). The DMA, DSC and XRD tests are used to characterize the change of dynamic property, heat capacity and microstructure with annealing treatments. The uniaxial tension tests together with the DIC technique are employed to describe the failure behaviors of PETG. The results show that the annealed polymers exhibit a larger maximum local strain and fail at a smaller displacement. The type and size of the geometry defects can also affect the strain localization and final failure behaviors of PETG. 相似文献
70.
《Ceramics International》2022,48(22):33092-33100
CeNbO4+δ ceramics have attracted extensive research interest because of their unique mixed ion-electron transport characteristics and interesting structure-functional characteristics caused by the difference in oxygen ion content. Although the change of oxygen ion content brings rich redox properties, it also causes serious crystal transformation and abnormal electrical transport properties. In order to obtain stable structure and excellent electrical transport properties, the directional regulation of the oxygen ion content has been realized through introducing Al2O3 and high temperature aging. After 600 h of aging at 1073 K, the prepared composite ceramics not only obtain a stable structure without crystal transformation, but also show good negative temperature coefficient (NTC) thermistor characteristics in the temperature range of 473 K–1273 K, in which the linear fitting maximum Pearson's r of the relationship between lnρ and 1000/T can reach 99.97%. The proposed method provides a new thought for the design and application of high-temperature electronic ceramics. 相似文献